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PODCAST

3D InCites Podcast

Francoise von Trapp

As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry,

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All Episodes

31:11

Acoustic Inspection: The Key to Semiconductor...

3D InCites Podcast ·

2025/04/17

Send us a textAcoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan Schackmuth, Senior Product Line Manager at Nordson Test and Inspection, reveals how this technology has evolved from laboratory tools to production-line essentials.When ultrasound encounters even the tiniest air gap—we're talking hundreds of angstroms—it reflects completely, making acoustic imaging

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60:02

Chip Champions: How The 3D InCites Award Winners Are...

3D InCites Podcast ·

2025/04/10

Send us a text The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology. • SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates • Eric Gongora, of MacDermid Alpha, explains how NovaFab fine-grained copper enables hybrid bonding with customizable...

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37:32

Why Supply Chain Resilience Matters and How to Get It

3D InCites Podcast ·

2025/04/03

Send us a text Navigating today's complex manufacturing landscape demands unprecedented supply chain resilience. This eye-opening conversation with Barry O'Dowd (Kuehne+Nagel) and Kamal Aluwalia (Resilinc) reveals why robust supply chains matter more than ever—particularly for semiconductor capital equipment. The semiconductor industry operates at extraordinary precision, with equipment working at scales as small as five nanometers—roughly 1/18,000th the width of a human hair. This precision...

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41:45

3D InCites Member Spotlight: How Advanced Packaging...

3D InCites Podcast ·

2025/03/27

Send us a text The 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor packaging innovation and domestic manufacturing expansion. • Rex Anderson of Micross details their RESHAPE program funding and Integra acquisition, establishing them as North America's largest domestic OSAT • Calvin Cheung of ASE explains how advanced packaging enables AI infrastructure while reduc...

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42:59

From IMAPS DPC 2025: How Arizona's Universities and...

3D InCites Podcast ·

2025/03/20

Send us a text Arizona is transforming into the "Silicon Oasis" of America through an unprecedented collaboration that's reshaping semiconductor education from high school through graduate studies. At the heart of this revolution is a groundbreaking partnership between the University of Arizona and Chandler Unified School District, launching the nation's first high school career and technical education program focused on semiconductor manufacturing. Starting July 2025, forty students will be...

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23:51

From IMAPS DPC 2025: How Artificial Intelligence is...

3D InCites Podcast ·

2025/03/13

Send us a text What happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussion recorded live at IMAPS Device Packaging Conference in Phoenix, Arizona. Join our expert panel featuring Hemanth Jagannathan (IBM Research), Mark Kuemerle (Marvell), and Kimon Michaels (PDF Solutions) as they tackle AI's most pres...

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26:43

What's In Store for IMAPS DPC 2025: Featuring Amy...

3D InCites Podcast ·

2025/02/13

Send us a textExplore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor opportunities reflecting the rising interest in this field. Get ready to embrace the future of packaging with insights that redefine its

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37:32

SEMI ISS 2025 Recap and Semiconductor Market Update

3D InCites Podcast ·

2025/02/06

Send us a textThe episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry's journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of AI, while also addressing industry challenges and emerging trends.Additionally, SEMI's Market Intelligence team dive into the revised 2024 equipment forecast and World Fab Forecast, discussing trends influenced by AI technology and

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32:56

The Role of Material Modeling in Semiconductor...

3D InCites Podcast ·

2024/12/19

Send us a textUnlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel's Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving demands of AI, machine learning, and quantum technologies. Dariush and Rose share their wealth of knowledge on material characterization, modeling, and ...

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18:55

Koh Young's Michael Zahn Talks About Putting 3D...

3D InCites Podcast ·

2024/12/12

Send us a textThis episode was recorded live at SEMICON Europa. Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies. They discuss the transition from 2D to 3D measurements in semiconductor manufacturing. Zahn explains why non-destructive, optical 3D measurements offer precise height and position data with sub-micron resolution. You'll learn how these measurements

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46:10

SEMICON Europa 3D InCites Member Spotlight: 20 Under...

3D InCites Podcast ·

2024/12/05

Send us a textThis episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence, ERS Electronic, KLA, and Semilab. It also features updates from Comet Yxlon, Trymax Semiconductor, and DSV-IMS. SEMI Europe's 20 Under 30 program recognizes future leaders in the microelectronics industry. James McGrath from KLA discussed his role as a PE CBD Process Engineer and his unexpected entry into the semiconductor industry

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44:45

SEMICON Europa 2024: Can Digital Twins Help Solve...

3D InCites Podcast ·

2024/11/28

Send us a textIn this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe’s technical sovereignty, and how implementing digital twins can help achieve this goal. John Behnke, of Inficon, discussed the evolution of smart manufacturing in the semiconductor industry. He highlighted how smart software can increase factory productivity by 5-15% by making autonomous decisions based on digital twins. You’ll

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42:30

SEMICON Europa 2024: How Do We Power Sustainable...

3D InCites Podcast ·

2024/11/21

Send us a textThis episode was recorded live at SEMICON Europa in Munich. This year's theme of this year’s conference is "Innovation and Collaboration: Powering Sustainable Exponential Growth". In other words, how the semiconductor industry can work together to sustainably reach the trillion dollar goal by 2030 without compromising its Net Zero goals. It's going to be tricky, for sure.Frederic Godemel of Schneider Electric talks about what he calls the “energy trilemma” that is

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42:52

The U.S. CHIPS for America Mash-Up

3D InCites Podcast ·

2024/11/14

Send us a textIt's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline of the year's progress. First up is Dan Berger, National Advanced Packaging Manufacturing Program (NAPMP), who explains how CHIPS Acts monies are being used to

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64:58

Onto Innovation's PACE Partners Talk About...

3D InCites Podcast ·

2024/11/07

Send us a textOn September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand opening to learn why the company has partnered with like-minded suppliers of the panel-level packaging ecosystem to accelerate the development of PLP technologies for both organic and glass substrates. These include 3D InCites Members: LPKF Laser & Electronics, Evatec, MKS-Atotech and Lam

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84:06

LIVE from Boston MA: Member Highlights from IMAPS...

3D InCites Podcast ·

2024/10/24

Send us a textRecorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies. Brendan Wells, Amkor Technologies, Inc., explains the difference between laminate and strip-based substrates for advanced packaging and when to use each. He also discusses how chiplet integration is impacting the assembly processes. Evan Griffith and Sze Pe Lim,

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20:30

IMAPS Society Award Winners Talk About How Belonging...

3D InCites Podcast ·

2024/10/17

Send us a textAt IMAPS Symposium 2024, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selected by a panel of previous winners, so it’s very special to receive one, as it means many members have noticed their efforts. In this episode, Françoise sits down with three of the award winners to talk about their IMAPS experience, at different stages of their careers.Emma P Pawliczak was awarded the

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47:46

Live from IMAPS Symposium 2024: Updates on the NAPMP,...

3D InCites Podcast ·

2024/10/10

Send us a textThis episode was recorded live at the IMAPS International Symposium in Boston MA. Françoise von Trapp speaks with Dev Palmer, director of the National Advanced Packaging Manufacturing Program; Sandeep Sane of Lightmatter; Craig Bishop, Deca and Brett Wilkerson, AMD. Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importance of bridging research and industry and describes some of the programs key initiatives

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39:11

Lam Research’s Chee Ping Lee Explains the Role of HBM...

3D InCites Podcast ·

2024/10/03

Send us a textIn this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design. HBM memory has received a lot of attention as one of the first technologies to implement 2.5D and 3D stacking. Lee explains how HBM uses advanced packaging technologies like TSV and microbumps to achieve high memory capacity and performance. Lam Research's solutions are key to

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20:52

Comet's Isabella Drolz Explains How 3D X-Ray Uses AI...

3D InCites Podcast ·

2024/09/26

Send us a textIn this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced AI technologies themselves. von Trapp and Drolz explore the evolution of inspection methods in advanced packaging, noting the complexity of 3D ICs and the

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184 results

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