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PODCAST

PCB Chat

Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)

technology tech news

All Episodes

01:10:17

RM Episode 63: A Conversation with Reliability Expert...

PCB Chat ·

2021/03/16

Dock Brown brings his more than 30 years of electronics reliability experience to clients of Ansys. Prior to joining Ansys, he spent 20 years at Medtronic where he most recently concentrated on cross business unit implementation of reliability initiatives for Class III medical devices. He was also responsible for supplier assessment and approval, on-going supplier audits, failure analysis, corrective actions, MRB, sampling, and ultimately full accountability for quality and reliability of commercial

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01:06:42

RM Episode 62: A Conversation with Cogiscan's...

PCB Chat ·

2021/03/10

By now, most of us have heard of Industry 4.0, or the Industrial Internet of Things (IIOT), or Smart Factory, or Factory of the Future. The key all of these acronyms is Connectivity, Data Management, Material and Process Control, Traceability, and Analytics. It’s not as simple as collecting data. The data much be understood, useful, and contextual. François Monette, is cofounder and chief business development Officer at Cogiscan, a company specializing in Track Trace Control products for the

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36:25

PCB Chat 74: DuPont's Andy Kannurpatti

PCB Chat ·

2021/03/02

A little over two years ago DuPont opened its Silicon Valley Technology Center. It is also finishing work on a major investment at its laminates manufacturing plant in Circleville, OH. Andy Kannurpatti, global business leader - Films & Laminates, Interconnect Solutions of DuPont Electronics & Imaging, explains how DuPont is helping the domestic industry grow.

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36:52

RM Special Edition: A Conversation with IPC Chief...

PCB Chat ·

2021/02/25

This year’s APEX Expo is a virtual event. Matt Kelly and Mike Konrad discuss IPC's new technical conference focus and review a small sample of the upcoming technical presentations and professional development courses.

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58:35

RM 61: A Conversation with Flex Circuit and Additive...

PCB Chat ·

2021/02/09

Tara Dunn and Mike Konrad discuss the world of flex and rigid-flex circuits including flex best practices when it comes to design and use of flex technology. They also discuss the new world of additive electronics. Tara Dunn is a seasoned professional with more than 20 years in the electronics industry exclusively focused on the PCB sector. Her experience spans roles from manufacturing to sales and marketing. Tara was the founder of Omni PCB, a technical manufacturers representative for the

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26:31

PCB Chat 73: AJ Incorvaia on Desktop PCB Software

PCB Chat ·

2021/01/29

AJ Incorvaia is executive vice president of Siemens EDA, more familiarly known as Mentor. He joined Mentor in 2013 after more than 25 years in software engineering at OEMs and other major EDA vendors. He discusses the mainstream (desktop) PCB CAD market, its shift to internal sales channels, its upsides, and limitations with PCB Chat host Mike Buetow.

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01:03:47

RM 60: Collins' Dave Hillman about Solder Voiding

PCB Chat ·

2021/01/26

Solder voiding has been with us longer than we know. Modern x-ray inspection technology has allowed assemblers to see and quantify voiding. Metallurgical expert Dave Hillman from Collins Aerospace explains the causes and possible remedies for solder voiding. Dave Hillman is a metallurgical engineer in the Advanced Operations Engineering Department of Collins Aerospace in Cedar Rapids, Iowa. He serves as a consultant to manufacturing on material and processing problems. He served as a subject matter

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26:47

PCB Chat 72: Matt Wrosch on Transient Liquid Phase...

PCB Chat ·

2021/01/16

Matt Wrosch is senior products specialist at EMD Performance Materials. An expert in materials science, Matt has held a range of research, engineering and business development roles in the electronics industry in 1997. He has a master’s in materials science and engineering from UC San Diego and a bachelor’s from Michigan. He joins PCB Chat host Mike Buetow to discuss transient liquid phase sintering (TLPS) materials, how they compare with solder paste, conductive adhesives and TIMs, and their

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59:32

RM Episode 59: CMOS Inventor Dr. Eric Fossom

PCB Chat ·

2021/01/12

Eric Fossum is best known for the invention of the CMOS image sensor better known as the “camera-on-a-chip” used in billions of cameras, from smart phones to web cameras to ingestible pill cameras to DSLRs. In 2017, Eric was a co-recipient of the Queen Elizabeth Prize for Engineering, the world's top engineering prize (and considered by many as equivalent to the Nobel Prize) for the invention of digital imaging sensors. Eric was inducted into the National Inventors Hall of Fame and is member of

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06:27

PCB Chat 71: Is the US Ready for Smart Manufacturing?

PCB Chat ·

2020/12/31

Smart manufacturing, generally defined as the use of fully integrated, collaborative manufacturing systems that respond in real time to meet changing demands and conditions in the smart factory, in the supply network, and in customer needs, is quickly becoming reality. Is the US ready, or has it already been beaten by offshore companies? Mike Buetow considers the possibilities.

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08:02

RM 58: 2020 Round-Up

PCB Chat ·

2020/12/28

On this last episode of 2020 there are no guests, no experts, no best-practice advice. Just a short recap of 2020. We just reached more than 10,000 downloads of the podcast! A HUGE thank you to my audience and my guests for making this podcast possible! On this episode I'll announce the first few guests of the 2021 season of Reliability Matters. This is looking like a terrific season! We are now producing an audio-only format and a video format. The video format may be viewed on our new YouTube

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23:02

PCB Chat 70: Kent Balius on Front-End Engineering

PCB Chat ·

2020/12/27

Kent Balius has been at the forefront of front-end engineering for 30 years at some of the world's largest PCB fabricators. He spent the past 20 years at TTM / Viasystems, where he managed software applications and automation solutions for North America and Asia-Pacific operations. He just launched EPIC Front-End Engineering, which provides consultation, project management, software applications and development support to the PCB manufacturers, with the objectives of driving advanced automation to

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01:00:27

RM 57: A Conversation with CAF Expert Graham Naisbitt

PCB Chat ·

2020/12/11

Conductive anodic filament (CAF) is a form of electrochemical migration (ECM). Unlike surface-level ECM, CAF exists beneath the surface of the circuit assembly. Graham and Mike Konrad discuss the causes of CAF and methods to test for and mitigate CAF. Graham has an extensive history working in the electrical and electronic manufacturing industry. Graham was the IEC 1906 Lord Kelvin Award Winner. IEC TC91 WG2, 3 and 10 Maintenance Leader of 4 Standards. He is vice chair of the IPC 5-30 Cleaning and

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15:31

PCB Chat 69: Manny Marcano on Changes in the...

PCB Chat ·

2020/12/02

EMA Design Automation has recently added the Mentor ECAD sales staff from Trilogic EDA. Manny Marcano, president and founder of EMA, explains what this means for the PCB CAD marketplace, and how the mainstream CAD market is shaping up.

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50:09

RM 56: A Conversation about Solder Voiding with...

PCB Chat ·

2020/12/02

Voiding is the cause of multiple failure mechanisms. Mike Konrad speaks with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding. The guests may be reached here: Tim O'Neill AIM Solder toneill@aimsolder.com www.aimsolder.com Prakash Gango StenTech prakash@stentech.com www.stentech.com Kalyan

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49:20

RM 55 - A Conversation with SMTA President Dr. Martin...

PCB Chat ·

2020/11/10

Dr. Martin Anselm is a professor at Rochester Institute of Technology (RIT) and is also the newly elected president of the Surface Mount Technology Association or SMTA. Martin also worked for Universal Instruments. During his 12-year career at Universal Instruments, Martin was, among other positions, a process research engineer and manager of Failure Analysis Services. Martin completed his Ph.D. in materials science and engineering through Binghamton University. His research topic involved

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44:01

PCB Chat Episode 68: The IPC-2581 Consortium on...

PCB Chat ·

2020/11/06

IPC-2581 is a standard format for describing and transferring printed circuit board design and assembly manufacturing data from the OEM to fab and assembly. It is an open format developed by industry consensus through the auspices of IPC, and it is vendor-neutral. IPC-2581 is being rebranded as IPC-DPMX, which stands for Digital Product Model Exchange. On this episode of PCB Chat, host Mike Buetow is joined by IPC-2581 Consortium chair Hemant Shah, DfM expert Dana Korf, Cisco technical leader of

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25:06

PCB Chat Episode 67: Brad Griffin of Cadence on EMI...

PCB Chat ·

2020/10/30

Brad Griffin, product management group director at Cadence, returns to PCB Chat to discuss Clarity 3D Transient Solver, a new system-level simulation solution that solves EMI system design issues up to 10 times faster than legacy 3-D field solvers, and handles workloads that previously required anechoic test chambers to ensure EMC compliance.

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58:53

Reliability Matters Episode 54: A Conversation with...

PCB Chat ·

2020/10/29

Michael Ford and Mike Konrad talk about Digital Twin, its purpose, value, and its future. Michael Ford, senior director of emerging industry strategy at Aegis Software, has more than 30 years working within the electronics assembly manufacturing space. With a degree in electronics from the University of Wales, he started his career with Sony in the UK, creating software solutions as he acquired a broad range of manufacturing knowledge. He spent eight years working in Japan, which provided Ford the

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01:07:08

Reliability Matters Episode 53: Meet the Press - A...

PCB Chat ·

2020/10/15

In this episode, Mike Konrad speaks with Mike Buetow, Editor in Chief of PCD&F/CIRCUITS ASSEMBLY, Trevor Galbraith, publisher of Global SMT and Packaging, and Philip Stoten of Scoop TV. We discuss the state of the electronics assembly industry, the effects of COVID-19 on our industry, emerging technologies, and more.

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309 results

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