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PODCAST

PCB Chat

Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)

technology tech news

All Episodes

01:06:03

Concept to Creation - The Entrepreneurs of the...

PCB Chat ·

2021/04/23

Welcome to Mike Konrad's new podcast is called “Concept to Creation - The Entrepreneurs of the Electronic Assembly Industry.” On this podcast, Mike will interview industry founders to talk about the following topics: Concept Creation Execution Growth Challenges Successes / Failures Motivating Insights The first episode features Dr. Bill Cardoso of Creative Electron. Bill earned his AA degree at the age of 13. He went on to earn his BS, MS, and Ph.D. in electrical and computer

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01:09:47

RM65: Tim O’Neill and Fred Dimock on Voiding, Vacuum...

PCB Chat ·

2021/04/13

On part 2 of this series , we dive into oven profiling best practices. In part one, we looked at void mitigation and how vacuum reflow technology can help reduce or eliminate voiding. Our guests are Tim O’Neill from AIM Solder and Fred Dimock of BTU. Tim will discuss voiding mitigation from a materials standpoint while Fred will bring cover equipment and profiling strategies. Tim O'Neill is technical marketing manager for AIM Solder. Operating out of AIM’s US headquarters, Tim is responsible for

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51:22

RM 64: Tim O'Neill and Fred Dimock on Voiding, Vacuum...

PCB Chat ·

2021/04/02

On this episode, we’ll have a conversation with two industry experts on the subject of solder voiding mitigation and oven profiling, two subjects which influence solder voiding. This will be a two part episode. Here, we dive into void mitigation and how vacuum reflow technology can help reduce or eliminate voiding. Part two (episode 65) will discuss profiling best practices. Our guests are Tim O’Neill from AIM Solder and Fred Dimock of BTU. Tim will discuss voiding mitigation from a materials

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42:37

PCB Chat 75: Keshav and Tarun Amla of Avishtech on...

PCB Chat ·

2021/03/22

Design engineers are paying close attention to materials. It’s not just about the routing anymore. Keshav Amla and Tarun Amla are founder and CEO and cofounder and CTO, respectively, of Avishtech, a San Jose, CA-based developer of simulation and design software, specifically stack-up and 2D field solvers. They discuss how their signature software enables better board design and how it came to be endorsed by Lee Ritchey, one of the leading experts in signal integrity and PCB design.

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01:10:17

RM Episode 63: A Conversation with Reliability Expert...

PCB Chat ·

2021/03/16

Dock Brown brings his more than 30 years of electronics reliability experience to clients of Ansys. Prior to joining Ansys, he spent 20 years at Medtronic where he most recently concentrated on cross business unit implementation of reliability initiatives for Class III medical devices. He was also responsible for supplier assessment and approval, on-going supplier audits, failure analysis, corrective actions, MRB, sampling, and ultimately full accountability for quality and reliability of commercial

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01:06:42

RM Episode 62: A Conversation with Cogiscan's...

PCB Chat ·

2021/03/10

By now, most of us have heard of Industry 4.0, or the Industrial Internet of Things (IIOT), or Smart Factory, or Factory of the Future. The key all of these acronyms is Connectivity, Data Management, Material and Process Control, Traceability, and Analytics. It’s not as simple as collecting data. The data much be understood, useful, and contextual. François Monette, is cofounder and chief business development Officer at Cogiscan, a company specializing in Track Trace Control products for the

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36:25

PCB Chat 74: DuPont's Andy Kannurpatti

PCB Chat ·

2021/03/02

A little over two years ago DuPont opened its Silicon Valley Technology Center. It is also finishing work on a major investment at its laminates manufacturing plant in Circleville, OH. Andy Kannurpatti, global business leader - Films & Laminates, Interconnect Solutions of DuPont Electronics & Imaging, explains how DuPont is helping the domestic industry grow.

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36:52

RM Special Edition: A Conversation with IPC Chief...

PCB Chat ·

2021/02/25

This year’s APEX Expo is a virtual event. Matt Kelly and Mike Konrad discuss IPC's new technical conference focus and review a small sample of the upcoming technical presentations and professional development courses.

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58:35

RM 61: A Conversation with Flex Circuit and Additive...

PCB Chat ·

2021/02/09

Tara Dunn and Mike Konrad discuss the world of flex and rigid-flex circuits including flex best practices when it comes to design and use of flex technology. They also discuss the new world of additive electronics. Tara Dunn is a seasoned professional with more than 20 years in the electronics industry exclusively focused on the PCB sector. Her experience spans roles from manufacturing to sales and marketing. Tara was the founder of Omni PCB, a technical manufacturers representative for the

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26:31

PCB Chat 73: AJ Incorvaia on Desktop PCB Software

PCB Chat ·

2021/01/29

AJ Incorvaia is executive vice president of Siemens EDA, more familiarly known as Mentor. He joined Mentor in 2013 after more than 25 years in software engineering at OEMs and other major EDA vendors. He discusses the mainstream (desktop) PCB CAD market, its shift to internal sales channels, its upsides, and limitations with PCB Chat host Mike Buetow.

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01:03:47

RM 60: Collins' Dave Hillman about Solder Voiding

PCB Chat ·

2021/01/26

Solder voiding has been with us longer than we know. Modern x-ray inspection technology has allowed assemblers to see and quantify voiding. Metallurgical expert Dave Hillman from Collins Aerospace explains the causes and possible remedies for solder voiding. Dave Hillman is a metallurgical engineer in the Advanced Operations Engineering Department of Collins Aerospace in Cedar Rapids, Iowa. He serves as a consultant to manufacturing on material and processing problems. He served as a subject matter

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26:47

PCB Chat 72: Matt Wrosch on Transient Liquid Phase...

PCB Chat ·

2021/01/16

Matt Wrosch is senior products specialist at EMD Performance Materials. An expert in materials science, Matt has held a range of research, engineering and business development roles in the electronics industry in 1997. He has a master’s in materials science and engineering from UC San Diego and a bachelor’s from Michigan. He joins PCB Chat host Mike Buetow to discuss transient liquid phase sintering (TLPS) materials, how they compare with solder paste, conductive adhesives and TIMs, and their

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59:32

RM Episode 59: CMOS Inventor Dr. Eric Fossom

PCB Chat ·

2021/01/12

Eric Fossum is best known for the invention of the CMOS image sensor better known as the “camera-on-a-chip” used in billions of cameras, from smart phones to web cameras to ingestible pill cameras to DSLRs. In 2017, Eric was a co-recipient of the Queen Elizabeth Prize for Engineering, the world's top engineering prize (and considered by many as equivalent to the Nobel Prize) for the invention of digital imaging sensors. Eric was inducted into the National Inventors Hall of Fame and is member of

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06:27

PCB Chat 71: Is the US Ready for Smart Manufacturing?

PCB Chat ·

2020/12/31

Smart manufacturing, generally defined as the use of fully integrated, collaborative manufacturing systems that respond in real time to meet changing demands and conditions in the smart factory, in the supply network, and in customer needs, is quickly becoming reality. Is the US ready, or has it already been beaten by offshore companies? Mike Buetow considers the possibilities.

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08:02

RM 58: 2020 Round-Up

PCB Chat ·

2020/12/28

On this last episode of 2020 there are no guests, no experts, no best-practice advice. Just a short recap of 2020. We just reached more than 10,000 downloads of the podcast! A HUGE thank you to my audience and my guests for making this podcast possible! On this episode I'll announce the first few guests of the 2021 season of Reliability Matters. This is looking like a terrific season! We are now producing an audio-only format and a video format. The video format may be viewed on our new YouTube

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23:02

PCB Chat 70: Kent Balius on Front-End Engineering

PCB Chat ·

2020/12/27

Kent Balius has been at the forefront of front-end engineering for 30 years at some of the world's largest PCB fabricators. He spent the past 20 years at TTM / Viasystems, where he managed software applications and automation solutions for North America and Asia-Pacific operations. He just launched EPIC Front-End Engineering, which provides consultation, project management, software applications and development support to the PCB manufacturers, with the objectives of driving advanced automation to

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01:00:27

RM 57: A Conversation with CAF Expert Graham Naisbitt

PCB Chat ·

2020/12/11

Conductive anodic filament (CAF) is a form of electrochemical migration (ECM). Unlike surface-level ECM, CAF exists beneath the surface of the circuit assembly. Graham and Mike Konrad discuss the causes of CAF and methods to test for and mitigate CAF. Graham has an extensive history working in the electrical and electronic manufacturing industry. Graham was the IEC 1906 Lord Kelvin Award Winner. IEC TC91 WG2, 3 and 10 Maintenance Leader of 4 Standards. He is vice chair of the IPC 5-30 Cleaning and

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15:31

PCB Chat 69: Manny Marcano on Changes in the...

PCB Chat ·

2020/12/02

EMA Design Automation has recently added the Mentor ECAD sales staff from Trilogic EDA. Manny Marcano, president and founder of EMA, explains what this means for the PCB CAD marketplace, and how the mainstream CAD market is shaping up.

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50:09

RM 56: A Conversation about Solder Voiding with...

PCB Chat ·

2020/12/02

Voiding is the cause of multiple failure mechanisms. Mike Konrad speaks with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding. The guests may be reached here: Tim O'Neill AIM Solder toneill@aimsolder.com www.aimsolder.com Prakash Gango StenTech prakash@stentech.com www.stentech.com Kalyan

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49:20

RM 55 - A Conversation with SMTA President Dr. Martin...

PCB Chat ·

2020/11/10

Dr. Martin Anselm is a professor at Rochester Institute of Technology (RIT) and is also the newly elected president of the Surface Mount Technology Association or SMTA. Martin also worked for Universal Instruments. During his 12-year career at Universal Instruments, Martin was, among other positions, a process research engineer and manager of Failure Analysis Services. Martin completed his Ph.D. in materials science and engineering through Binghamton University. His research topic involved

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313 results

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